Limits RegistryPUBLIC RECORD
Limits RegistrySK Hynix announced a 321-layer 3D NAND flash memory chip in August 2023, at the time the highest layer count announced by a major NAND manufacturer, part of an industry-wide race among SK Hynix, Samsung, and Micron to keep increasing storage density by stacking memory cells vertically rather than shrinking them horizontally. Because layer-count records in this industry are announced by competing vendors roughly annually, this figure should be read as a snapshot rather than a permanent ceiling.
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SK Hynix announced a 321-layer 3D NAND flash memory chip in August 2023, at the time the highest layer count announced by a major NAND manufacturer, part of an industry-wide race among SK Hynix, Samsung, and Micron to keep increasing storage density by stacking memory cells vertically rather than shrinking them horizontally. Because layer-count records in this industry are announced by competing vendors roughly annually, this figure should be read as a snapshot rather than a permanent ceiling.
The greatest number of vertically stacked memory-cell layers announced in a 3D NAND flash memory chip by a major manufacturer, as of its announcement date.
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1 accepted Claim, with 1 linked evidence records.
Permanent ID limitsregistry.com/limits/LR-3D-NAND-LAYER-COUNT
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Limits Registry. LR-3D-NAND-LAYER-COUNT. Highest layer count in a 3D NAND flash memory chip. 2026.