Limits RegistryPUBLIC RECORD
Limits RegistrySamsung announced a 512 GB DDR5 DRAM module in February 2023, using 12-layer 3D through-silicon-via (TSV) stacking to combine many DRAM dies into a single module — at the time the largest capacity announced for a single DDR5 server memory module, intended for memory-hungry data-center and high-performance-computing workloads such as large-scale AI model training.
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Samsung announced a 512 GB DDR5 DRAM module in February 2023, using 12-layer 3D through-silicon-via (TSV) stacking to combine many DRAM dies into a single module — at the time the largest capacity announced for a single DDR5 server memory module, intended for memory-hungry data-center and high-performance-computing workloads such as large-scale AI model training.
The largest capacity announced for a single DDR5 registered DIMM memory module, achieved via 12-layer 3D through-silicon-via (TSV) DRAM die stacking.
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Permanent ID limitsregistry.com/limits/LR-DDR5-LARGEST-MEMORY-MODULE
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Limits Registry. LR-DDR5-LARGEST-MEMORY-MODULE. Largest capacity single DDR5 memory module. 2026.